| Copper (Cu) Series Sputtering Target/Cathode | |||
| Item | Material | Purities | Application |
| Cu | Copper | 99.9-99.9995% | Glass, Electronics, Smiconductor, Display |
| CuAl | Copper Aluminium | 99.9-99.999% |
Solar，Glass |
| CuCr | Copper Chromium | 99.9-99.99% | Electronics, Smiconductor |
| CuGa | Copper Gallium | 99.95-99.999% |
Photovoltaics |
| CuIn | Copper Indium |
99.95-99.999% |
Photovoltaics |
| CuNi | Copper Nickel | 99.9-99.99% |
Electronics, Smiconductor |
| Other Cu | Copper/Copper alloys | * | Others |
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GB/T 5231-2012 |
Designation and chemical composition of wrought copper and copper alloys |
| GB/T 26017-2010 |
High purity copper
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GB/T 29091-2012 |
Copper and copper alloy designation and code system |
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ASTM F68-2016 |
Standard Specification for Oxygen-Free Copper in Wrought Forms for Electron Devices |
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ASTM B248M-2017 |
Standard Specification for General Requirements for Wrought Copper and Copper -Alloy Plate, Sheet, Strip, and Rolled Bar (Metric) |
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| Copper Sputtering target | Forming (Smelting, Powder metallurgy) |
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| Inspection | Machining |
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| Analysis | Microstructure |
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| Surface Quality | Surface Quality |
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| Sputtering target and Cathode |
Sputtering target and Cathode |
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Sputtering target and Cathode |
Sputtering target and Cathode |
Contact: Sales Dept.
Phone: (86) 186 0101 9114 (ER only)
Tel: (86) 10-52868200/01/02/03
Email: sales@sinomaterial.com
Add: 5-301, Lincui West Road, Chaoyang, Beijing China
Sputtering target
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